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Resistance Quenching in Graphene Interconnects

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 Added by Alexander Balandin
 Publication date 2008
  fields Physics
and research's language is English




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We investigated experimentally the high-temperature electrical resistance of graphene interconnects. The test structures were fabricated using the focused ion beam from the single and bi-layer graphene produced by mechanical exfoliation. It was found that as temperature increases from 300 to 500K the resistance of the single- and bi-layer graphene interconnects drops down by 30% and 70%, respectively. The quenching and temperature dependence of the resistance were explained by the thermal generation of the electron-hole pairs and acoustic phonon scattering. The obtained results are important for the proposed applications of graphene as interconnects in integrated circuits.



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The weak temperature dependence of the resistance R(T) of monolayer graphene1-3 indicates an extraordinarily high intrinsic mobility of the charge carriers. Important complications are the presence of mobile scattering centres that strongly modify charge transport, and the presence of strong mesoscopic conductance fluctuations that, in graphene, persist to relatively high temperatures4,5. In this Letter, we investigate the surprisingly varied changes in resistance that we find in graphene flakes as temperature is lowered below 70 K. We propose that these changes in R(T) arise from the temperature dependence of the scattered electron wave interference that causes the resistance fluctuations. Using the field effect transistor configuration, we verify this explanation in detail from measurements of R(T) by tuning to different gate voltages corresponding to particular features of the resistance fluctuations. We propose simple expressions that model R(T) at both low and high charge carrier densities.
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