ترغب بنشر مسار تعليمي؟ اضغط هنا

Prototyping of petalets for the Phase-II Upgrade of the silicon strip tracking detector of the ATLAS Experiment

62   0   0.0 ( 0 )
 نشر من قبل Susanne Kuehn
 تاريخ النشر 2017
  مجال البحث فيزياء
والبحث باللغة English




اسأل ChatGPT حول البحث

In the high luminosity era of the Large Hadron Collider, the HL-LHC, the instantaneous luminosity is expected to reach unprecedented values, resulting in about 200 proton-proton interactions in a typical bunch crossing. To cope with the resultant increase in occupancy, bandwidth and radiation damage, the ATLAS Inner Detector will be replaced by an all-silicon system, the Inner Tracker (ITk). The ITk consists of a silicon pixel and a strip detector and exploits the concept of modularity. Prototyping and testing of various strip detector components has been carried out. This paper presents the developments and results obtained with reduced-size structures equivalent to those foreseen to be used in the forward region of the silicon strip detector. Referred to as petalets, these structures are built around a composite sandwich with embedded cooling pipes and electrical tapes for routing the signals and power. Detector modules built using electronic flex boards and silicon strip sensors are glued on both the front and back side surfaces of the carbon structure. Details are given on the assembly, testing and evaluation of several petalets. Measurement results of both mechanical and electrical quantities are shown. Moreover, an outlook is given for improved prototyping plans for large structures.



قيم البحث

اقرأ أيضاً

The Phase-II upgrade of the ATLAS detector for the High Luminosity Large Hadron Collider (HL-LHC) includes the replacement of the current Inner Detector with an all-silicon tracker consisting of pixel and strip detectors. The current Phase-II detecto r layout requires the construction of 20,000 strip detector modules consisting of sensor, circuit boards and readout chips, which are connected mechanically using adhesives. The adhesive between readout chips and circuit board is a silver epoxy glue as was used in the current ATLAS SemiConductor Tracker (SCT). This glue has several disadvantages, which motivated the search for an alternative. This paper presents a study concerning the use of six ultra-violet (UV) cure glues and a glue pad for use in the assembly of silicon strip detector modules for the ATLAS upgrade. Trials were carried out to determine the ease of use, the thermal conduction and shear strength, thermal cycling, radiation hardness, corrosion resistance and shear strength tests. These investigations led to the exclusion of three UV cure glues as well as the glue pad. Three UV cure glues were found to be possible better alternatives. Results from electrical tests of first prototype modules constructed using these glues are presented.
75 - Zhijun Liang 2018
In next ten years, the Large Hadron Collider will be upgraded to the High Luminosity LHC (HL-LHC), resulting in ten time more integrated luminosity. To withstand the much harsher radiation and occupancy conditions of the HL-LHC, the inner tracker of the ATLAS detector must be redesigned and rebuilt completely. The design of the ATLAS Upgrade inner tracker (ITk) has already been defined. It consists of several layers of silicon particle detectors. The innermost layers will be composed of silicon pixel sensors, and the outer layers will consist of silicon microstrip sensors. This paper will focus on the latest research and development activities performed by ITk strips community with respect to the assembly and test of the strip modules and the stave and petal structures.
The GERDA collaboration is performing a sensitive search for neutrinoless double beta decay of $^{76}$Ge at the INFN Laboratori Nazionali del Gran Sasso, Italy. The upgrade of the GERDA experiment from Phase I to Phase II has been concluded in Decemb er 2015. The first Phase II data release shows that the goal to suppress the background by one order of magnitude compared to Phase I has been achieved. GERDA is thus the first experiment that will remain background-free up to its design exposure (100 kg yr). It will reach thereby a half-life sensitivity of more than 10$^{26}$ yr within 3 years of data collection. This paper describes in detail the modifications and improvements of the experimental setup for Phase II and discusses the performance of individual detector components.
78 - Jike Wang 2017
ATLAS is making extensive efforts towards preparing a detector upgrade for the high luminosity operations of the LHC (HL-LHC), which will commence operation in about 10 years. The current ATLAS Inner Detector will be replaced by an all-silicon tracke r (comprising an inner Pixel tracker and outer Strip tracker). The software currently used for the new silicon tracker is broadly inherited from that used for the LHC Run-1 and Run-2, but many new developments have been made to better fulfill the future detector and operation requirements. One aspect in particular which will be highlighted is the simulation software for the Strip tracker. The available geometry description software (including the detailed description for all the sensitive elements, the services, etc.) did not allow for accurate modelling of the planned detector design. A range of sensors/layouts for the Strip tracker are being considered and must be studied in detailed simulations in order to assess the performance and ascertain that requirements are met. For this, highly flexibility geometry building is required from the simulation software. A new Xml-based detector description framework has been developed to meet the aforementioned challenges. We will present the design of the framework and its validation results.
For the Phase-II Upgrade of the ATLAS Detector, its Inner Detector, consisting of silicon pixel, silicon strip and transition radiation sub-detectors, will be replaced with an all new 100 % silicon tracker, composed of a pixel tracker at inner radii and a strip tracker at outer radii. The future ATLAS strip tracker will include 11,000 silicon sensor modules in the central region (barrel) and 7,000 modules in the forward region (end-caps), which are foreseen to be constructed over a period of 3.5 years. The construction of each module consists of a series of assembly and quality control steps, which were engineered to be identical for all production sites. In order to develop the tooling and procedures for assembly and testing of these modules, two series of major prototyping programs were conducted: an early program using readout chips designed using a 250 nm fabrication process (ABCN-25) and a subsequent program using a follow-up chip set made using 130 nm processing (ABC130 and HCC130 chips). This second generation of readout chips was used for an extensive prototyping program that produced around 100 barrel-type modules and contributed significantly to the development of the final module layout. This paper gives an overview of the components used in ABC130 barrel modules, their assembly procedure and findings resulting from their tests.
التعليقات
جاري جلب التعليقات جاري جلب التعليقات
سجل دخول لتتمكن من متابعة معايير البحث التي قمت باختيارها
mircosoft-partner

هل ترغب بارسال اشعارات عن اخر التحديثات في شمرا-اكاديميا