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تسجيل مستخدم جديدOverview of Spanish Tracking R&D for FLC
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Alberto Ruiz-Jimeno
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An overview of the present and foreseen R&D activities of the Spanish network for future accelerators aiming to participate in the design and construction of the forward tracker and vertex detectors of the Future Linear Colliders, is shown.
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We report the status of R&D on large triple-GEM detectors for a forward tracker (FT) in an experiment at a future Electron Ion Collider (EIC) that will improve our understanding of QCD. We have designed a detector prototype specifically targeted for
the EIC-FT, which has a trapezoidal shape with 30.1 degrees opening angle. We are investigating different detector assembly techniques and signal readout technologies, but have designed a common GEM foil to minimize NRE cost for foil production. The assembly techniques comprise either a purely mechanical method including foil stretching as pioneered by CMS but with certain modifications, or gluing foils to frames that are then assembled mechanically, or gluing foils to frames that are then glued together. The first two assembly techniques allow for re-opening chambers so that a GEM foil can be replaced if it is damaged. For readout technologies, we are pursuing a cost-effective one-dimensional readout with wide zigzag strips that maintains reasonable spatial resolution, as well two-dimensional readouts - one with stereo-angle (u-v) strips and another with r-phi strips. In addition, we aim at an overall low-mass detector design to facilitate good energy resolution for electrons scattered at low momenta. We present design for GEM foils and other detector parts, which we plan to entirely acquire from U.S. companies.
Significant progress has been made to develop silicon pixel technologies for use in the vertex and tracker regions of the proposed Compact Linear Collider (CLIC) detector design. The electron-positron collisions generated by this linear accelerator p
rovide a clean, low-radiation environment for the inner detectors. However, physics-driven performance targets, the CLIC beam structure, and occupancies from beam-induced backgrounds place challenging requirements on detector technologies for this region. A pixel pitch down to 25 x 25$mu$m$^{-2}$, material budget $leq$ 0.2-2$%X_0$ per layer, average power dissipation of down to 50mWcm$^{-2}$, position resolution of 3-7$mu$m, and timing resolution as low as 5ns are called for in the vertex and tracking detectors. To this aim, a comprehensive R&D programme is ongoing to design and test silicon pixel detectors to fulfil these specifications, including both monolithic and hybrid devices. These studies involve Allpix$^2$ Monte Carlo and TCAD simulations, advanced 65nm ASIC and sensor design, laboratory testing, and beam tests of individual modules to determine the required performance parameters. The characterisation and simulation modelling of these devices has also lead to the development of a set of tools and software within the CLIC detector and physics (CLICdp) collaboration. This publication will present recent results from the technologies being developed and tested in view of the CLIC vertex and tracking detector requirements, such as various monolithic CMOS sensors, and fine pitch hybrid assemblies with planar sensors.
This report reviews current trends in the R&D of semiconductor pixellated sensors for vertex tracking and radiation imaging. It identifies requirements of future HEP experiments at colliders, needed technological breakthroughs and highlights the rela
tion to radiation detection and imaging applications in other fields of science.
Many experiments are currently using or proposing to use large area GEM foils in their detectors, which is creating a need for commercially available GEM foils. Currently CERN is the only main distributor of GEM foils, however with the growing intere
st in GEM technology keeping up with the increasing demand for GEM foils will be difficult. Thus the commercialization of GEM foils has been established by Tech-Etch Inc. of Plymouth, MA, USA using the single-mask technique, which is capable of producing GEM foils over a meter long. To date Tech-Etch has successfully manufactured 10 $times$ 10 cm$^2$ and 40 $times$ 40 cm$^2$ GEM foils. We will report on the electrical and geometrical properties, along with the inner and outer hole diameter size uniformity of these foils. Furthermore, Tech-Etch has now begun producing even larger GEM foils of 50 $times$ 50 cm$^2$, and are currently looking into how to accommodate GEM foils on the order of one meter long. The Tech-Etch foils were found to have excellent electrical properties. The measured mean optical properties were found to reflect the desired parameters and are consistent with those measured in double-mask GEM foils, as well as single-mask GEM foils produced at CERN. They also show good hole diameter uniformity over the active area.
The high pseudo-rapidity region of the CMS muon system is covered by Cathode Strip Chambers (CSC) only and lacks redundant coverage despite the fact that it is a challenging region for muons in terms of backgrounds and momentum resolution. In order t
o maintain good efficiency for the muon trigger in this region additional RPCs are planned to be installed in the two outermost stations at low angle named RE3/1 and RE4/1. These stations will use RPCs with finer granularity and good timing resolution to mitigate background effects and to increase the redundancy of the system.
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