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The DArk Matter Particle Explorer (DAMPE) is a space-borne high energy cosmic-ray and $gamma$-ray detector which operates smoothly since the launch on December 17, 2015. The bismuth germanium oxide (BGO) calorimeter is one of the key sub-detectors of DAMPE used for energy measurement and electron proton identification. For events with total energy deposit higher than decades of TeV, the readouts of PMTs coupled on the BGO crystals would become saturated, which results in an underestimation of the energy measurement. Based on detailed simulations, we develop a correction method for the saturation effect according to the shower development topologies and energies measured by neighbouring BGO crystals. The verification with simulated and on-orbit events shows that this method can well reconstruct the energy deposit in the saturated BGO crystal.
A BGO electromagnetic calorimeter (ECAL) is built for the DArk Matter Particle Explorer (DAMPE) mission. The effect of temperature on the BGO ECAL was investigated with a thermal vacuum experiment. The light output of a BGO crystal depends on tempera
The BGO calorimeter, which provides a wide measurement range of the primary cosmic ray spectrum, is a key sub-detector of Dark Matter Particle Explorer (DAMPE). The readout electronics of calorimeter consists of 16 pieces of Actel ProASIC Plus FLASH-
DAMPE is a space-based mission designed as a high energy particle detector measuring cosmic-rays and $gamma-$rays which was successfully launched on Dec.17, 2015. The BGO electromagnetic calorimeter is one of the key sub-detectors of DAMPE for energy
The Mu2e electromagnetic calorimeter is made of two disks of un-doped parallelepiped CsI crystals readout by SiPM. There are 674 crystals in one disk and each crystal is readout by an array of two SiPM. The readout electronics is composed of two type
The SiD collaboration is developing a Si-W sampling electromagnetic calorimeter, with anticipated application for the International Linear Collider. Assembling the modules for such a detector will involve special bonding technologies for the intercon