Mode-division multiplexing (MDM) is becoming an enabling technique for large-capacity data communications via encoding the information on orthogonal guiding modes. However, the on-chip routing of a multimode waveguide occupies too large chip area due to the constraints on inter-mode cross talk and mode leakage. Very recently, many efforts have been made to shrink the footprint of individual element like bending and crossing, but the devices still occupy >10x10 um2 footprint for three-mode multiplexed signals and the high-speed signal transmission has not been demonstrated yet. In this work, we demonstrate the first MDM circuits based on digitized meta-structures which have extremely compact footprints. The radius for a three-mode bending is only 3.9 {mu}m and the footprint of a crossing is only 8x8um2. The 3x100 Gbit/s mode-multiplexed signals are arbitrarily routed through the circuits consists of many sharp bends and compact crossing with a bit error rate under forward error correction limit. This work is a significant step towards the large-scale and dense integration of MDM photonic integrated circuits.
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