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تسجيل مستخدم جديدThe D0 Silicon Microstrip Tracker
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This paper describes the mechanical design, the readout chain, the production, testing and the installation of the Silicon Microstrip Tracker of the D0 experiment at the Fermilab Tevatron collider. In addition, description of the performance of the detector during the experiment data collection between 2001 and 2010 is provided.
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When testing and calibrating particle detectors in a test beam, accurate tracking information independent of the detector being tested is extremely useful during the offline analysis of the data. A general-purpose Silicon Beam Tracker (SBT) was const
ructed with an active area of 32.0 x 32.0 mm2 to provide this capability for the beam calibration of the Cosmic Ray Energetics And Mass (CREAM) calorimeter. The tracker consists of two modules, each comprised of two orthogonal layers of 380 {mu}m thick silicon strip sensors. In one module each layer is a 64-channel AC-coupled single-sided silicon strip detector (SSD) with a 0.5 mm pitch. In the other, each layer is a 32-channel DC-coupled single-sided SSD with a 1.0 mm pitch. The signals from the 4 layers are read out using modified CREAM hodoscope front-end electronics with a USB 2.0 interface board to a Linux DAQ PC. In this paper, we present the construction of the SBT, along with its performance in radioactive source tests and in a CERN beam test in October 2006.
This paper describes the design, fabrication, installation and performance of the new inner layer called Layer 0 (L0) that was inserted in the existing Run IIa Silicon Micro-Strip Tracker (SMT) of the D0 experiment at the Fermilab Tevatron collider.
L0 provides tracking information from two layers of sensors, which are mounted with center lines at a radial distance of 16.1 mm and 17.6 mm respectively from the beam axis. The sensors and readout electronics are mounted on a specially designed and fabricated carbon fiber structure that includes cooling for sensor and readout electronics. The structure has a thin polyimide circuit bonded to it so that the circuit couples electrically to the carbon fiber allowing the support structure to be used both for detector grounding and a low impedance connection between the remotely mounted hybrids and the sensors.
While the tracking detectors of the ATLAS and CMS experiments have shown excellent performance in Run 1 of LHC data taking, and are expected to continue to do so during LHC operation at design luminosity, both experiments will have to exchange their
tracking systems when the LHC is upgraded to the high-luminosity LHC (HL-LHC) around the year 2024. The new tracking systems need to operate in an environment in which both the hit densities and the radiation damage will be about an order of magnitude higher than today. In addition, the new trackers need to contribute to the first level trigger in order to maintain a high data-taking efficiency for the interesting processes. Novel detector technologies have to be developed to meet these very challenging goals. The German groups active in the upgrades of the ATLAS and CMS tracking systems have formed a collaborative Project on Enabling Technologies for Silicon Microstrip Tracking Detectors at the HL-LHC (PETTL), which was supported by the Helmholtz Alliance Physics at the Terascale during the years 2013 and 2014. The aim of the project was to share experience and to work together on key areas of mutual interest during the R&D phase of these upgrades. The project concentrated on five areas, namely exchange of experience, radiation hardness of silicon sensors, low mass system design, automated precision assembly procedures, and irradiations. This report summarizes the main achievements.
In next ten years, the Large Hadron Collider will be upgraded to the High Luminosity LHC (HL-LHC), resulting in ten time more integrated luminosity. To withstand the much harsher radiation and occupancy conditions of the HL-LHC, the inner tracker of
the ATLAS detector must be redesigned and rebuilt completely. The design of the ATLAS Upgrade inner tracker (ITk) has already been defined. It consists of several layers of silicon particle detectors. The innermost layers will be composed of silicon pixel sensors, and the outer layers will consist of silicon microstrip sensors. This paper will focus on the latest research and development activities performed by ITk strips community with respect to the assembly and test of the strip modules and the stave and petal structures.
A PC based high speed silicon microstrip beam telescope consisting of several independent modules is presented. Every module contains an AC-coupled double sided silicon microstrip sensor and a complete set of analog and digital signal processing elec
tronics. A digital bus connects the modules with the DAQ PC. A trigger logic unit coordinates the operation of all modules of the telescope. The system architecture allows easy integration of any kind of device under test into the data acquisition chain. Signal digitization, pedestal correction, hit detection and zero suppression are done by hardware inside the modules, so that the amount of data per event is reduced by a factor of 80 compared to conventional readout systems. In combination with a two level data acquisition scheme, this allows event rates up to 7.6 kHz. This is a factor of 40 faster than conventional VME based beam telescopes while comparable analog performance is maintained achieving signal to noise ratios of up to 70:1. The telescope has been tested in the SPS testbeam at CERN. It has been adopted as the reference instrument for testbeam studies for the ATLAS pixel detector development.
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